POC-400
Intel® Elkhart Lake Atom® x6425E ultra-compact DIN-rail fanless rugged computer with 1x 2.5GbE, 2x 2.5G PoE+ and 2x USB 3.1 Gen1
- Intel® Elkhart Lake Atom® x6425E quad-core 2.0GHz/ 3.0GHz 12W processor
- Rugged -25 °C to 70 °C fanless operation
- 2x 2.5GbE PoE+ ports and 1x 2.5GbE port with screw-lock
- 2x USB 3.1 Gen1 and 2x USB 2.0 ports with screw-lock
- M.2 2280 M key SATA interface
- Dual DP display outputs supporting 4096 x 2160 resolution
- Front I/O access DIN-mounting design
- MezIO® compatible
Introduction
POC-400 is an ultra-compact fanless embedded computer for industrial applications. It utilizes the latest Intel® Elkhart Lake platform Atom® x6425E 4-core CPU that can deliver 1.8x CPU and 2x GPU performance improvement, compared to the previous generation.
In addition to the performance boost, POC-400 features an ultra-compact design measuring just 56 x 108 x 153 mm, which can easily fit into restricted spaces. The system comes with a DIN-rail mounting chassis and an abundance of front-access I/O interfaces. Featuring three 2.5GBASE-T Ethernet ports with IEEE 802.3 PoE+ capability, they provide higher data bandwidth for devices such as NBASE-T cameras and is backward-compatible with 1000/100/10 Mbps Ethernet. It also has two 4K DisplayPort, 2x USB3.1 Gen1, 2x USB 2.0 and COM ports for general industrial applications.
Supporting Neousys' proprietary MezIO® interface for function expansion, you can add functions such as isolated DIO, RS-232/422/485, ignition control and 4G/ 5G by installing a MezIO® module. Moreover, POC-400 comes with an internal M.2 E key socket for a Google TPU or an Intel® Movidius VPU module to transform it into a lightweight AI inference platform at the edge.
Combining the new 10nm Atom® CPU, 2.5G Ethernet ports, PoE+ and ultra-compact enclosure with function expansion capabilities, Neousys’ POC-400 is a compact and yet versatile embedded controller that can fuel various industrial applications.
Specification
System Core | |
---|---|
Processor | Intel® Elkhart Lake Atom® x6425E quad-core 2.0GHz/3.0GHz 12W processor |
Graphics | Integrated Intel® UHD Graphics |
Memory | Up to 32 GB DDR4-3200 SDRAM by one SODIMM socket |
TPM | Supports fTPM 2.0 |
Panel I/O Interface | |
Ethernet | 3x 2.5GBASE-T Ethernet ports by Intel® I225 GbE controllers |
POE | Optional IEEE 802.3at PoE+ on port #2 and #3 |
Video Port | 2x DisplayPort connector, supporting 4096 x 2160 resolution @ 60Hz |
USB | 2x USB 3.1 Gen1 (5 Gbps) ports 2x USB 2.0 ports |
Serial Port | 1x software-programmable RS-232/422/485 ports (COM1) 3x 3-wire RS-232 ports (COM2/3/4) or 1x RS-422/485 port (COM2) |
Audio | 1x 3.5 mm jack for mic-in and speaker-out |
Internal Expansion Bus | |
M.2 E key | 1x M.2 2230 E key socket for WiFi, Google TPU or Movidius VPU module |
Expandable I/O | 1x MezIO® expansion port for Neousys MezIO® modules |
Storage Interface | |
---|---|
M.2 M key | 1x M.2 2280 SATA interface |
Power Supply | |
DC Input | 1x 3-pin pluggable terminal block for 8-35V DC input |
Mechanical | |
Dimension | 56 mm (W) x 108 mm (D) x 153 mm (H) |
Weight | 0.96kg |
Mounting | DIN-rail mount (standard) or Wall-mount (optional) |
Environmental | |
Operating Temperature | -25°C ~ 70°C*/** |
Storage Temperature | -40°C ~85°C |
Humidity | 10%~90% , non-condensing |
Vibration | Operating, MIL-STD-810G, Method 514.7, Category 4 |
Shock | Operating, MIL-STD-810G, Method 516.7, Procedure I |
EMC | CE/FCC Class A, according to EN 55032 & EN 55035 |