Nuvo-5026E
Optional 802.3at PoE+ for GbE port 3 ~ port 6
Intel® 6th-Gen Core™ fanless embedded computer with dual PCIe Cassette, 6x GbE and MezIO™
Optional 802.3at PoE+ for GbE port 3 ~ port 6
- Intel® 6th Gen Core™ i7/ i5/ i3 LGA1151 35W/ 65W
- Dual PCIe x8 slots in patented expansion Cassette*
- MezIO™ interface for easy function expansion
- Rugged, wide temperature range from -25°C to 70°C fanless operation
- 6x GbE ports, supporting 9.5 KB jumbo frame
- Up to 32 GB, DDR4-2133 SODIMM
- Accommodates two 2.5" SATA HDD/ SSD with RAID 0/1 support
- VGA/ DVI/ DP triple independent display, supporting 4K2K resolution
Introduction
Nuvo-5026E fanless embedded computer is the latest Nuvo-5000 family member with dual PCIe slots. The dual PCIe slots enhance expansion abilities while preserving all practical features such as ruggedness, performance and versatility.
The expandability makes Nuvo-5026E more adaptable to various application needs while the two PCle slots in the patented expansion Cassette are easy to access for PCIe card installation without the need to disassemble the system.
Nuvo-5026E supports LGA1151 6th Gen Core™ processors. It offers processor selection flexibility from Core™ i7 to Celeron according to performance needs and operating environment. It also offers plenty of I/O functions such as 6x GbE, 4x USB 3.1 Gen1, 3x COM ports and triple independent display. In addition, Neousys' MezIO™ interface can also further expand system I/Os offering up to either 11x COM ports, 10x GbE, 8x USB 3.1 Gen1, 32x DIO or ignition power control by installing an optional MezIO™ module.
Nuvo-5026E is an expandable and flexible platform with numerous I/O functions for various industrial applications.
■ NEOUSYS MARKETING TEAM
Specification
System Core | |
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Processor | Intel® Core™ i7-6700 (8M Cache,3.4/ 4.0 GHz, 65W TDP)* Intel® Core™ i5-6500 (6M Cache, 3.2/ 3.6 GHz, 65W TDP)* Intel® Core™ i3-6100 (3M Cache, 3.7 GHz, 51W TDP)* Intel® Pentium® G4400 (3M Cache, 3.3 GHz, 54W TDP)* Intel® Celeron® G3900 (2M Cache, 2.8 GHz, 51W TDP)* Intel® Core™ i7-6700TE (8M Cache, 2.4/ 3.4 GHz, 35W TDP) Intel® Core™ i5-6500TE (6M Cache, 2.3/ 3.3 GHz, 35W TDP) Intel® Core™ i3-6100TE (4M Cache, 2.7 GHz, 35W TDP) Intel® Pentium® G4400TE (3M Cache, 2.4 GHz, 35W TDP) Intel® Celeron® G3900TE (2M Cache, 2.3 GHz, 35W TDP) |
Chipset | Intel® Q170 platform controller hub |
Graphics | Integrated Intel® HD graphics 530 or 510 (CPU dependent) |
Memory | Up to 32 GB DDR4-2133 SDRAM by two SODIMM sockets |
AMT | Supports AMT 11.0 |
TPM | Supports TPM 2.0 |
I/O Interface | |
---|---|
Ethernet Port | 6x Gigabit Ethernet ports by Intel® I219 and 5x I210 |
POE+ | Optional IEEE 802.3at PoE+ PSE for GbE Port 3 ~ Port 6, 80 W total power budget |
USB | 4x USB 3.1 Gen1 ports via native xHCI controller 4x USB 2.0 ports |
Video Port | 1x stacked VGA + DVI-D connector 2x DisplayPort connectors, supporting 4K2K resolution |
Serial Port | Port 2x software-programmable RS-232/422/485 port (COM1 & COM3) 1x RS-232 port (COM2) |
Audio | 1x Mic-in and 1x Speaker-out |
Storage interface | |
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SATA HDD | 2x internal SATA port for 2.5” HDD/ SSD installation, supporting RAID 0/ 1 |
mSATA | 1x full-size mSATA port (mux with mini-PCIe) |
Expansion Bus/ Internal I/O Interface | |
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PCI/PCI Express | 2x PCIe x8 slot @ Gen3, 4-lanes PCIe signals in expansion Cassette |
Mini PCI-E | 1x internal mini PCI Express socket with front-accessible SIM socket 1x internal mini PCI Express socket with internal SIM socket (mux with mSATA) |
Expandable I/O | 1x MezIO™ expansion port for Neousys’ MezIO™ modules |
Power Supply | |
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DC Input | 1x 3-pin pluggable terminal block for 8V to 35V DC input |
Remote Ctrl. & Status Output | 1x 10-pin (2x5) wafer connector for remote on/off control and status LED output |
Mechanical | |
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Dimension | 240 mm (W) x 225 mm (D) x 111 mm (H) |
Weight | 3.7 kg (incl. CPU, GPU, memory and HDD) |
Mounting | Wall-mount by mounting bracket (standard) or DIN-Rail mounting (optional) |
Environmental | |
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Operating temperature | with i7-6700TE, i5-6500TE, i3-6100TE, Pentium G4400TE(35W TDP) -25°C ~ 70°C * with i7-6700, i5-6500, i3-6100 (65W/51W TDP) -25°C ~ 70°C */ ** (configured as 35W CPU mode) -25°C ~ 50°C */ ** (configured as 65W/51W CPU mode) |
Storage temperature | -40°C ~ 85°C |
Humidity | 10%~90%, non-condensing |
Vibration | Operating, 5 Grms, 5-500 Hz, 3 Axes(w/ SSD, according to IEC60068-2-64) |
Shock | Operating, 50 Grms, half-sine 11 ms duration (w/ SSD, according to IEC60068-2-27) |
EMC | CE/ FCC Class A, according to EN 60950, EN55024 & EN55032 |